HSB11-252518
CUI Devices
Product No:
HSB11-252518
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 25 X 25 X 18 MM
Quantity:
In Stock : 54
Minimum: 1 Multiples: 1
Qty
Unit Price
1
1.216
10
1.15235
25
1.12176
50
1.09155
100
1.030845
250
0.970254
500
0.909606
1000
0.848968
5000
0.818644
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.984" (25.00mm) |
| Length | 0.984" (25.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 13.70°C/W |
| Power Dissipation @ Temperature Rise | 5.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
Feedback