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HSS-B20-NP-01

CUI Devices

Product No:

HSS-B20-NP-01

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEATSINK TO-220 4.1W ALUMINUM

Quantity:

In Stock : Please Inquiry

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Product Information

Parameter Info
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.775" (19.68mm)
Length 0.787" (20.00mm)
Series HSS
Package Bag
Diameter -
Material Aluminum
Fin Height 0.303" (7.70mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method -
Base Product Number HSS-B20
Thermal Resistance @ Natural 18.29°C/W
Power Dissipation @ Temperature Rise 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow 7.05°C/W @ 200 LFM